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Preparation, characterization and application in cobalt ion adsorption using nanoparticle films of hybrid copper–nickel hexacyanoferrate

21

Citations

51

References

2019

Year

Abstract

Different mole ratios (<i>n</i> <sub>Cu</sub> : <i>n</i> <sub>Ni</sub> = <i>x</i> : <i>y</i>) of hybrid copper-nickel metal hexacyanoferrates (Cu <sub><i>x</i></sub> Ni <sub><i>y</i></sub> HCFs) were prepared to explore their morphologies, structure, electrochemical properties and the feasibility of electrochemical adsorption of cobalt ions. Cyclic voltammetry (CV), field emission scanning electron microscopy (FE-SEM), Fourier transform infrared spectroscopy (FTIR) and X-ray diffraction (XRD) indicated that the <i>x</i> : <i>y</i> ratio of Cu <sub><i>x</i></sub> Ni <sub><i>y</i></sub> HCF nanoparticles can be easily controlled as designed using a wet chemical coprecipitation method. The crystallite size and formal potential of Cu <sub><i>x</i></sub> Ni <sub><i>y</i></sub> HCF films showed an insignificant change when 0 ≤ <i>x</i> : <i>y</i> < 0.3. Given the shape of the CV curves, this might be due to Cu<sup>2+</sup> ions being inserted into the NiHCF framework as countercations to maintain the electrical neutrality of the structure. On the other hand, crystallite size depended linearly on the <i>x</i> : <i>y</i> ratio when <i>x</i> : <i>y</i> > 0.3. This is because Cu tended to replace Ni sites in the lattice structure at higher molar ratios of <i>x</i> : <i>y</i>. Cu <sub><i>x</i></sub> Ni <sub><i>y</i></sub> HCF films inherited good electrochemical reversibility from the CuHCFs, in view of the cyclic voltammograms; in particular, Cu<sub>1</sub>Ni<sub>2</sub>HCF exhibited long-term cycling stability and high surface coverage. The adsorption of Co<sup>2+</sup> fitted the Langmuir isotherm model well, and the kinetic data can be well described by a pseudo-second order model, which may imply that Co<sup>2+</sup> adsorption is controlled by chemical adsorption. The diffusion process was dominated by both intraparticle diffusion and surface diffusion.

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