TeraPHY: A High-density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module

Abstract

In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.