Improved dielectric stability of epoxy composites with ultralow boron nitride loading

Abstract

due to the formation of a BN microplatelet thermal conduction network at an ultralow BN loading of 4 vol%, which is about 5-fold and 3-fold higher than that of neat epoxy and random BN/EP composite with the same BN loading. Meanwhile, the dielectric constant variation of the BN/PA66 composites is only 6%, showing much better stability in the dielectric properties than neat epoxy and random BN/EP composites over the temperature range 25-200 °C. Our research provides a new strategy to prepare the 3D BN aerogels and proves that the 3D BN/PA66 aerogel is a potential platform for preparing polymer-based composites with excellent dielectric stability.