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Csp<sup>3</sup>–Csp<sup>3</sup> Bond-Forming Reductive Elimination from Well-Defined Copper(III) Complexes

134

Citations

58

References

2019

Year

Abstract

Carbon-carbon bond-forming reductive elimination from elusive organocopper(III) complexes has been considered the key step in many copper-catalyzed and organocuprate reactions. However, organocopper(III) complexes with well-defined structures that can undergo reductive elimination are extremely rare, especially for the formation of Csp<sup>3</sup>-Csp<sup>3</sup> bonds. We report herein a general method for the synthesis of a series of [alkyl-Cu<sup>III</sup>-(CF<sub>3</sub>)<sub>3</sub>]<sup>-</sup> complexes, the structures of which have been unequivocally characterized by NMR spectroscopy, mass spectrometry, and X-ray crystal diffraction. At elevated temperature, these complexes undergo reductive elimination following first-order kinetics, forming alkyl-CF<sub>3</sub> products with good yields (up to 91%). Both kinetic studies and DFT calculations indicate that the reductive elimination to form Csp<sup>3</sup>-CF<sub>3</sub> bonds proceeds through a concerted transition state, with a Δ H<sup>⧧</sup> = 20 kcal/mol barrier.

References

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