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Evaluation of wireless network-on-chip architectures with microchannel-based cooling in 3D multicore chips

System On Chip3D Ic ArchitectureMicrochannel-based CoolingEngineeringAdvanced Packaging (Semiconductors)Liquid Metal CoolingMulticore ChipsComputer ArchitectureComputer EngineeringNetwork On ChipElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringWireless Network-on-chip Architectures