Study on Failure Simulation and Fatigue Life Prediction of BGA Solder Joint Under Random Vibration

Abstract

Aiming at the problem of BGA solder joint failure under random vibration, random vibration simulation and fatigue life prediction were studied, and the results were verified by experiments. Firstly, the three-dimensional finite element model of the solder joint was established by ANSYS software. The vibration characteristics of the model were obtained by analyzing the first five modes. Then the random vibration simulation analysis was performed. It was found that the solder joint had 3 extremely vulnerable areas. After that, the fatigue life of the solder joint was estimated to be 601mins using the empirical formula and three-band technique. Finally, a random vibration test was conducted. The test results show that there are 3 failure modes in the solder joint, which are consistent with the simulation analysis results; and the fatigue lifetime of the solder joint is 697mins, which means the accuracy of the fatigue life prediction is 86.2%.