Journal of The Electrochemical Society · 2019 · 31 citations · 22 references
Natural SciencesChemistryMaterials ScienceElectrochemistryMaterials ChemistryThin FilmsElectroanalytical ChemistryElectrochemical KineticsElectrode KineticsElectrode MaterialsElectrode-electrolyte InterfacesMetal SulfidesBarrier Layer FormationElectrochemical Impedance AnalysisElectrochemical MeasurementsFilm Growth MechanismsMetal Sulfide ElectrodesMetal Sulfide Thin FilmsPassive Film GrowthSurface Chemistry Of Metal Sulfides
The electrochemical growth of copper sulfide films on copper has been studied voltammetrically and potentiostatically in 0.1 M sodium chloride solutions containing sulfide concentrations ranging from 10−4 M to 10−3 M. The properties of the films formed were investigated using electrochemical impedance spectroscopy. Film growth was observed to occur in two stages: the initial formation of a thin porous base layer at low potentials, followed by film restructuring leading to increased porosity and the deposition of an outer copper sulfide layer at more positive potentials. At more oxidizing potentials the overall film growth rate was determined by the properties of the outer deposit, not by the formation of a passive barrier layer at the Cu/film interface.
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