Publication | Closed Access
Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling
75
Citations
59
References
2018
Year
Materials ScienceMaterials EngineeringImcs LayerEngineeringMaterial PropertyMechanical EngineeringMaterial InnovationHigh-performance MaterialSn-58bi Solder JointMaterial PerformanceMo NanoparticlesElectronic PackagingMicrostructureMaterial Preparation
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