Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 725 citations

Engineering, Materials Engineering, Materials Science +7

Study on bulk aluminum matrix nano-composite fabricated by ultrasonic dispersion of nano-sized SiC particles in molten aluminum alloy

Yong Yang, Jie Lan, Xiaochun Li · Materials Science and Engineering A · 2004 · 629 citations

Natural Sciences, Materials Engineering, Materials Science +17

Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics · 2004 · 437 citations

Natural Sciences, Materials Engineering, Materials Science +16

Mechanical properties of nano-silver joints as die attach materials

Kim S. Siow · Journal of Alloys and Compounds · 2011 · 384 citations

Natural Sciences, Materials Engineering, Materials Science +12