Concepedia

Curing kinetics of diglycidyl ether of Bisphenol-A epoxy system using a tertiary amine, through the study of its rheometric characteristics

F. López-Barajas, S. Sánchez‐Valdés, E. Ramírez‐Vargas, G. Martínez-Colunga, Adriana B. Espinoza‐Martínez, Sergio G. Flores‐Gallardo, J. Méndez‐Nonell, Ana Beatriz Morales–Cepeda, Tomás Lozano, F.I. Beltrán-Ramírez

Polymer Testing · 2018 · 26 citations · 16 references

DOI

Concepts

References

16

Enhanced Thermal Conductivity of Epoxy–Graphene Composites by Using Non‐Oxidized Graphene Flakes with Non‐Covalent Functionalization

Sung Ho Song, Kwang Hyun Park, Bo‐Hyun Kim et al. · Advanced Materials · 2012 · 667 citations

, , +17

Thermoplastic toughening of epoxy resins: a critical review

J. H. Hodgkin, George P. Simon, Russell J. Varley · Polymers for Advanced Technologies · 1998 · 392 citations · Full text

, , +11

Epoxy thermosetting systems: Dynamic mechanical analysis of the reactions of aromatic diamines with the diglycidyl ether of bisphenol A

P. G. Babayevsky, J. K. Gillham · Journal of Applied Polymer Science · 1973 · 199 citations

, , +17

Thermal scanning rheometer analysis of curing kinetic of an epoxy resin: 2. An amine as curing agent

José Manuel Laza, C.A. Julian, E. Larrauri et al. · Polymer · 1999 · 131 citations

, , +16

Effect of crosslink density on fracture behavior of model epoxies containing block copolymer nanoparticles

Jia Liu, Hung‐Jue Sue, Zachary J. Thompson et al. · Polymer · 2009 · 119 citations

, , +17