Publication | Closed Access
Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders
18
Citations
30
References
2018
Year
Materials ScienceMaterials EngineeringElectrical EngineeringExperimental VerificationEngineeringElectromigration TechniqueSn-0.7cu SoldersInterconnect (Integrated Circuits)Applied PhysicsMetallurgical InteractionIntermetallic Compounds GrownElectronic PackagingMicroelectronicsElectrochemistry
| Year | Citations | |
|---|---|---|
Page 1
Page 1