Publication | Open Access
Cold spraying for power electronics: Deposition of thick topologically patterned copper layers on ceramics
18
Citations
7
References
2018
Year
EngineeringMechanical EngineeringCold WorkingCopper CoatingsPower ElectronicsCeramic PowdersChemical DepositionElectronic PackagingTopological PatternProtective CoatingMaterials ScienceThermal Spray CoatingCopper LayersThermal Barrier CoatingCold SprayingHeat TransferHigh Temperature MaterialsApplied PhysicsPrimary DiagnosticsMetal-ceramic SystemsThermal EngineeringSurface ProcessingElectrical Insulation
The paper presents the results of research and development of cold gas-dynamic spray regimes for production of copper coatings on ceramic substrates. Samples with a topological pattern of coating were obtained and their primary diagnostics was carried out. In particular, it is shown that the samples obtained can withstand thermal cycling (more than 100 cycles) in the temperature range from -60 to +150 °C.
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