An Overview of Wide Bandgap Power Semiconductor Device Packaging Techniques for EMI Reduction

Abstract

Wide band gap (WBG) power semiconductor devices have been increasingly desirable due to their superior characteristics compared to their Si counterparts. However, their faster switching speed and abilities to operate at higher frequency than Si devices have brought new challenges, among which Electromagnetic interference (EMI) issue is one of the major concerns. EMI issues in WBG device applications had been reported in many papers. However, package layout determined characteristics has not yet been connected to electromagnetic compliance (EMC) analysis. In this paper, characteristics of WBG power devices as EMI noise sources are investigated, package design considerations that could reduce EMI are reviewed.