Thermal Management Technology of IGBT Modules Based on Two-Dimensional Materials

Abstract

With the rapid development of modern power electronics, the current level of IGBT modules has been promoted continuously. It presents a great challenge to the thermal management of the system and heat dissipation structure design. Due to the special two-dimensional structure, graphene and hexagonal boron nitride have excellent properties in heat conduction. This paper presents a new solution for packaging cooling of high-power IGBT modules, in which graphene would be used in thin film form on the copper coated ceramic substrate surface. In comparison to another application scheme that using graphene film on the IGBT chip, this thermal management solution can better improve the heat dissipation performance of IGBT modules. Meanwhile the hexagonal boron nitride would be filled into the encapsulating resin as bridges for filler particles, so as to decrease the thermal resistance of the packaging structure in horizontal and vertical at the same time. The preparation and transfer processes of two-dimensional materials are the key factors that influence the cooling effect.