Ruthenium Electrodeposition from Deep Eutectic Solvents

Abstract

Ruthenium is electrodeposited for the first time from a deep eutectic solvent based electrolyte composed of ethylene glycol and
\ncholine chloride in 1:2 molar ratio. Deposition is found to effectively occur upon addition of sulfamic acid to the Ru(III) containing
\ndeep eutectic solvent. The main consequence of the presence of sulfamic acid, as evidenced by the electrochemical characterization
\nperformed, is the oxidation of Ru(III) to Ru(IV). Consequently, Ru electroreduction is demonstrated to take place from the tetravalent
\nstate. Optimized plating conditions are able to yield uniform and crack-free Ru coatings up to 800 nm thickness. No oxides or other
\nnotable secondary phases can be individuated in the obtained metallic layers. Morphological and electrical properties of the layers
\nobtained are comparable with Ru coatings deposited from sputtering and suggest possible applications in the electronics field as
\nbarrier layers for interdiffusion.