Kinetics of Curing of Epoxy Oligomer by Diaminodiphenyl Sulfone: Rheology and Calorimetry

Abstract

Diaminodiphenyl sulfone is used as a curing agent to obtain an epoxy-resin-based binder with improved thermal stability. The kinetics of curing of this composition is studied by rheokinetic and calorimetric methods. It is shown that complete conversion is attained at a temperature of 200°С or higher. The rate of viscosity increase in the course of time in curing under flow conditions does not depend on the shear rate; the viscosity changes monotonically. The curing reaction occurs in the homogeneous mode without separation of a crosslinked polymer; it is described by a second-order equation with self-deceleration at low temperatures. The rheokinetic characteristics and temperature dependences of kinetic parameters of the process are determined.