Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper

Abstract

Bidentate diamine and amino-alcohol ligands have been used to form solid, water-soluble, and air-stable monomeric copper complexes of the type [Cu(NH₂CH₂CH(R)Y)₂(NO₃)₂] (<b>1</b>, R=H, Y=NH₂; <b>2</b>, R=H, Y=OH; <b>3</b>, R=Me, Y=OH). The complexes were characterized by elemental analysis, mass spectrometry, infrared spectroscopy, thermal gravimetric analysis, and single-crystal X-ray diffraction. Irrespective of their decomposition temperature, precursors <b>1</b>-<b>3</b> yield highly conductive copper features [1.5×10^-6 Ω m (±5×10^-7 Ω m)] upon atmospheric-pressure plasma-enhanced sintering.