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Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies

Electrical EngineeringFatigue LifeEngineeringBga PackagesDurability PerformanceHardware ReliabilityRandom FrequenciesService Life PredictionMechanical EngineeringStructural Health MonitoringElectronic PackagingStructural MechanicsLow-cycle FatigueMechanics Of Materials