2018 · 16 citations · 6 references
EngineeringElectrical EngineeringMaterials EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsHigh-frequency Semiconductor DevicesIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationMicrowave Integrated CircuitsRadio-frequency Integrated CircuitsHeterogeneous IntegrationHigh-frequency ElectronicsMicrowave DevicesMicrowave Integrated Circuit DesignMonolithic Microwave Integrated CircuitsPower OutputRadio-frequency Integrated Circuit DesignSilicon
An integrated frequency quadrupler operating at 160 GHz, producing 100 mW of output power, and achieving peak efficiency of 25.5% is described. The quadrupler design is based on prior art and consists of GaAs Schottky diodes with epitaxy transferred to a micromachined silicon carrier forming a heterogeneously-integrated chip. A newly-developed fabrication process that eliminates high temperature annealing and utilizes SU-8 for adhesive bonding was employed to realize the circuit. The new process improves device yield and reliability compared to previous implementations.
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Naser Alijabbari, Matthew F. Bauwens, Robert M. Weikle · IEEE Transactions on Terahertz Science and Technology · 2014 · 48 citations