Publication | Open Access

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

Materials ScienceMaterials EngineeringEngineeringSuperalloyMechanical EngineeringAlloy DesignAlloy PhaseAlloy CastingElectronic PackagingBga AssembliesFailure BehaviourAccelerated Temperature CyclingLow-cycle FatigueMechanics Of MaterialsMicrostructure