Concepedia

Accelerated temperature cycling induced strain and failure behaviour for BGA assemblies of third generation high Ag content Pb-free solder alloys

Eric Dalton, Guang Ren, Jeff Punch, Maurice N. Collins

Materials & Design · 2018 · 80 citations · 46 references

DOI

Concepts

References

46

Accelerated Testing: Statistical Models, Test Plans, and Data Analyses.

Ewan MacArthur, William Nelson · Journal of the Royal Statistical Society Series C (Applied Statistics) · 1992 · 1.4K citations

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Advances in lead-free electronics soldering

Katsuaki Suganuma · Current Opinion in Solid State and Materials Science · 2001 · 725 citations

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Structure and properties of lead-free solders bearing micro and nano particles

Liang Zhang, K. N. Tu · Materials Science and Engineering R Reports · 2014 · 322 citations

, , +14

Lead-Free Solder Interconnect Reliability

Soldering and Surface Mount Technology · 2005 · 199 citations

, , +14

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

J.H.L. Pang, T.H. Low, B.S. Xiong et al. · Thin Solid Films · 2004 · 198 citations

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