Unveiling the interfacial configuration in diamond/Cu composites by using statistical analysis of metallized diamond surface

Thermal boundary resistance

Ed Swartz, R. O. Pohl · Reviews of Modern Physics · 1989 · 2.9K citations

Engineering, Materials Engineering, Materials Science +17

Emerging challenges and materials for thermal management of electronics

Arden L. Moore, Li Shi · Materials Today · 2014 · 2K citations · Full text

Engineering, Materials Engineering, Materials Science +17

Multigate transistors as the future of classical metal–oxide–semiconductor field-effect transistors

Isabelle Ferain, Cynthia A. Colinge, Jean-Pierre Colinge · Nature · 2011 · 1K citations

Engineering, Electrical Engineering, Materials Science +13

Thermal conductivity of SPS consolidated Cu/diamond composites with Cr-coated diamond particles

Ke Chu, Zhaofang Liu, Chengchang Jia et al. · Journal of Alloys and Compounds · 2009 · 299 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

Tim Schubert, Ł. Ciupiński, Witold Zieliński et al. · Scripta Materialia · 2007 · 284 citations

Natural Sciences, Materials Engineering, Materials Science +16