ACS Photonics · 2018 · 121 citations · 28 references
Optical MaterialsEngineeringIntegrated CircuitsSilicon On InsulatorMode Exchange DeviceProgrammable PhotonicsAdvanced Packaging (Semiconductors)NanoelectronicsOptical PropertiesPhotonic Integrated CircuitElectronic PackagingOptical CommunicationOptical Communication SystemNanophotonicsPhotonicsSemiconductor Device FabricationPhotonic DeviceDifferent Mode ChannelsMicrofabricationApplied PhysicsOptoelectronics
Data exchange among different mode channels is indispensable for optical communication system adopting mode-division multiplexing. Traditional mode exchange device is complex in procedure and large in footprint, which makes it not suitable for dense and large-scale photonic integration. Utilizing the degree of freedom of silicon meta-structure, we design an ultracompact and optically broadband mode exchange device between TE0 and TE1 modes by the step-by-step inverse-design method considering the axisymmetric constraint. Simulation result shows that it is robust to a temperature variation of 100 K and a fabrication error of ±20 nm. The fabricated device is 4 × 1.6 μm2 in footprint. The simulated conversion efficiencies are over 73% and 71% for TE0 to TE1 and TE1 to TE0 within the whole C-band, and the experimental results are about 10% lower than the simulation. 40 Gbps OOK and 25 GBaud PAM-4 data transmission through the device are carried out, which shows good signal quality. We envision that the device will offer a flexible mode manipulation in optical interconnect system.
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WDM-compatible mode-division multiplexing on a silicon chip
Lian-Wee Luo, Noam Ophir, Christine P. Chen et al. · Nature Communications · 2014 · 806 citations · Full text
An integrated-nanophotonics polarization beamsplitter with 2.4 × 2.4 μm2 footprint
Bing Shen, Peng Wang, Randy Polson et al. · Nature Photonics · 2015 · 730 citations