Publication | Closed Access
High thermal conductivity liquid metal pad for heat dissipation in electronic devices
70
Citations
36
References
2018
Year
Materials ScienceElectrical EngineeringElectronic DevicesEngineeringLiquid Metal CoolingNanoelectronicsThermal TransportApplied PhysicsHeat DissipationThermodynamicsThermal ConductionHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringThermal ConductivityThermal PropertyElectrical Insulation
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