Publication | Open Access

On the interfacial phase growth and vacancy evolution during accelerated electromigration in Cu/Sn/Cu microjoints

Materials ScienceMaterials EngineeringElectrical EngineeringVacancy EvolutionEngineeringElectromigration TechniqueNanoelectronicsSurface ScienceApplied PhysicsMetallurgical InteractionAccelerated ElectromigrationInterfacial Phase GrowthMicroelectronicsElectrochemical InterfaceInterconnect (Integrated Circuits)