Publication | Open Access
A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm<sup>2</sup> Die-to-Die Optical Networks
20
Citations
6
References
2018
Year
Silicon photonics has allowed cost reduction and performance improvement for optical interconnects for the past few years, and short-reach wavelength-division-multiplexed (WDM) links have recently emerged thanks to the introduction of microring modulators and filters [1-5]. Nevertheless, the promise of optical networks-on-chip foreseen in [1] has to face the integration challenges of scalable low-footprint elementary drivers and robust operation under heavy thermal stress due to self-heating of the cores with varying loads. This work presents a 3D-stacked CMOS-on-Si-photonic transceiver chip, which includes base building-blocks targeting die-to-die WDM optical communication for multicore processors: 10Gbps 2.5V <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">pp</inf> OOK modulator driver, associated receiver, and digitally-supervised analog wavelength stabilization using microring heaters and remapping for 0-to-90°C operating range, for a total footprint of 0.01mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> per microring.
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