Publication | Closed Access
In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs
15
Citations
6
References
2018
Year
Optical MaterialsEngineeringIn-line Soa IntegrationIntegrated PhotonicsDevice IntegrationOptoelectronic DevicesIntegrated CircuitsSilicon Photonics PlatformSilicon Photonics ChipProgrammable PhotonicsOptical AmplifierOptical AmplificationOptical PropertiesOptical SwitchingPhotonic Integrated Circuit4Ch-soa ArrayPhotonicsOptical InterconnectsIn-line Optical AmplificationFlip-chip Bonded Inp-soasPhotonic DeviceApplied PhysicsOptoelectronics
We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4×4 switch with a 4ch-SOA array.
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