Publication | Closed Access

Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity

Materials EngineeringMaterials ScienceHigh Thermal ConductivityEngineeringPower DeviceMechanical EngineeringTough Silicon NitridesCarbideElectronic PackagingMicroelectronicsThermal EngineeringLow-cycle FatigueMicrostructure