Publication | Open Access
A Highly Thermostable In2O3/ITO Thin Film Thermocouple Prepared via Screen Printing for High Temperature Measurements
61
Citations
20
References
2018
Year
Screen PrintingEngineeringThin Film Process TechnologyPrinted ElectronicsThermodynamicsElectronic PackagingThin Film ProcessingMaterials ScienceGlass AdditivesSintering ProcessHeat TransferThermocouple TechnologyHigh Temperature MaterialsApplied PhysicsTemperature MeasurementThermoelectric MaterialThin FilmsThermal SensorThermal EngineeringHigh Temperature Measurements
An In₂O₃/ITO thin film thermocouple was prepared via screen printing, with glass additives added to improve sintering and increase film density. The thermocouple exhibited a 53.5 mV voltage at 1270 °C, a 44.5 μV/°C Seebeck coefficient, and a drift rate of 5.44 °C/h over 10 h, with grain size and densification improving as annealing time increased.
An In₂O₃/ITO thin film thermocouple was prepared via screen printing. Glass additives were added to improve the sintering process and to increase the density of the In₂O₃/ITO films. The surface and cross-sectional images indicate that both the grain size and densification of the ITO and In₂O₃ films increased with the increase in annealing time. The thermoelectric voltage of the In₂O₃/ITO thermocouple was 53.5 mV at 1270 °C at the hot junction. The average Seebeck coefficient of the thermocouple was calculated as 44.5 μV/°C. The drift rate of the In₂O₃/ITO thermocouple was 5.44 °C/h at a measuring time of 10 h at 1270 °C.
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