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Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

Electrical EngineeringEngineeringFlexible ElectronicsHigh Frequency ApplicationsMechanical EngineeringComposite TechnologyContinuous-fibre CompositeComputational ElectromagneticsNumerical CharacterizationElectronic PackagingStructural MechanicsThin Woven CompositesThin-walled StructureFiber-reinforced CompositeElectromagnetic Compatibility