Publication | Closed Access
High resolution thickness measurements of ultrathin Si:P monolayers using weak localization
26
Citations
40
References
2018
Year
EngineeringWeak LocalizationSilicon On InsulatorDopant MovementP MonolayersLayer ThicknessTunneling MicroscopyNanoelectronicsEpitaxial GrowthMaterials ScienceElectrical EngineeringPhysicsSemiconductor Device FabricationMicroelectronicsSurface ScienceApplied PhysicsUltrathin SiDelta-layer ThicknessMultilayer Heterostructures
The key building blocks for the fabrication of devices based on the deterministic placement of dopants in silicon using scanning tunneling microscopy (STM) hydrogen lithography are the formation of well-defined dopant delta-layers and the overgrowth of high quality crystalline Si. To develop these capabilities, it is of critical importance to quantify dopant movement in the sub-nanometer regime. To this end, we investigate Si:P delta-layer samples produced by fully exposing a Si surface to PH3 prior to Si encapsulation with dramatically different levels of dopant confinement. We examine the effect of delta layer confinement on the weak localization signal in parallel and perpendicular magnetic fields and extract the delta-layer thickness from fits to the Hikami-Larkin-Nagaoka equation. We find good agreement with secondary ion mass spectroscopy measurements and demonstrate the applicability of this method in the sub-nanometer thickness regime. Our analysis serves as detailed instruction for the determination of the conducting layer thickness of a Si:P delta-layer by means of a high-throughput, nondestructive electrical transport measurement.
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