Concepedia

Publication | Closed Access

Aluminum metallization and wire bonding aging in power MOSFET modules

DOI

14

Citations

17

References

2018

Year

R. Ruffilli, Mounira Berkani, P. Dupuy, Sébastien Lefebvre, Y. Weber, B. Warot-Fonrose, Cécile Marcelot, M. Legros
Materials Today Proceedings

References

YearCitations

Page 1