Concepedia

Cu–Al interfacial compounds and formation mechanism of copper cladding aluminum composites

Di Chu, Jianyu Zhang, Jin-jin Yao, Yan-qiu Han, Chun-jing Wu

Transactions of Nonferrous Metals Society of China · 2017 · 31 citations · 12 references

DOI

Concepts

References

12

Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculation

Byeong‐Joo Lee, Nong‐Moon Hwang, Hyuck Mo Lee · Acta Materialia · 1997 · 268 citations

, , +16

Fabrication of aluminum/copper clad composite using hot hydrostatic extrusion process and its material characteristics

Kyong Yop Rhee, H.J. Park, S.S. Kim · Materials Science and Engineering A · 2004 · 131 citations

, , +14

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

Ousama M. Abdelhadi, Leila Ladani · Journal of Alloys and Compounds · 2012 · 117 citations

, , +9

Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al

Y. Tanaka, M. Kajihara, Yoshimi Watanabe · Materials Science and Engineering A · 2006 · 109 citations

, , +17

A thermodynamic assessment of the Al-Cu-Mg ternary system

T. Buhler, Suzana G. Fries, P.J. Spencer et al. · Journal of Phase Equilibria and Diffusion · 1998 · 73 citations

, , +14