Publication | Closed Access
Paralleling high power dual modules: A challenge for application engineers and power device manufacturers
20
Citations
5
References
2017
Year
Unknown Venue
Current ImbalanceEngineeringPower Device ManufacturersIgbt ModulesPower Optimization (Eda)Power Electronics ConverterComputer ArchitectureElectric Power ConversionPower Electronic SystemsPower ElectronicsAdvanced Packaging (Semiconductors)High Voltage EngineeringParallel ComputingPower-aware DesignPower Electronic DevicesElectrical EngineeringComputer EngineeringApplication EngineersDual ModulesPower DeviceParallel ProgrammingPower Inverter
This paper discusses the challenges of paralleling dual modules with special focus on the currently introduced dual modules like LinPak, nHPD <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , XHP, LV/HV100, etc. Compared with IHM/IHV Modules 3 to 4 times as many modules have to be paralleled to achieve the same output power. Therefore the parallel connection will play a major role in designing high power converters, used e.g. in traction applications. This paper explains the reasons of current mismatch in parallel connection of IGBT modules and gives suggestions how to minimize current imbalance.
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