Effects of various conditions in cold-welding of copper nanowires: A molecular dynamics study

Abstract

Cold-welding possesses such desirable environment as low temperature and low applied stress, thus becoming the prime candidate for nanojointing and nanoassembly techniques. To explore the welding mechanism of nanoscale structures, here, molecular dynamics was performed on copper nanowires under different welding conditions and various original characteristics to obtain an atomic-level depiction of their cold-welding behavior. By analyzing the mechanical properties of as-welded nanowires, the relations between welding quality and welding variables are revealed and identified. This comparison study will be of great importance to future mechanical processing and structural assembly of metallic nanowires.