Publication | Closed Access
Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles
30
Citations
37
References
2017
Year
Materials ScienceChemical EngineeringEngineeringMetal NanoparticlesNanomaterialsNanotechnologyApplied PhysicsNanostructure SynthesisMetallic NanomaterialsThermal ConductivityNanocompositeExcellent ConductivityHeat TreatmentFabrication Procedure
Fabrication procedure of conductive Cu NP paste using sub-10 nm copper nanoparticles for excellent conductivity without heat treatment.
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