Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study - Concepedia

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Adhesive transfer at copper/diamond interface and adhesion reduction mechanism with fluorine passivation: A first-principles study

78

Citations

41

References

2017

Year

Zengjia Liu, Shaoxian Zheng, Zhibin Lu, Jibin Pu, Guangan Zhang

Materials ScienceEngineeringNanotechnologyAdhesive MaterialSurface ScienceApplied PhysicsFluorine PassivationSurface ModificationSurface TreatmentAdhesive TransferAdhesion Reduction MechanismStructural Adhesive

References

	Year	Citations

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