Publication | Open Access

Experimental investigation of PCM based round pin-fin heat sinks for thermal management of electronics: Effect of pin-fin diameter

Electrical EngineeringEngineeringExperimental InvestigationLiquid Metal CoolingMechanical EngineeringThermal ManagementPin-fin DiameterThermodynamicsThermal ModelingElectronic PackagingHeat TransferHeat PipeThermal Engineering