Publication | Closed Access
Three dimensional shape and stress monitoring of bulk carriers based on iFEM methodology
115
Citations
20
References
2017
Year
Electrical EngineeringDimensional ShapeEngineeringMechanical EngineeringStressstrain AnalysisStructural Health MonitoringSolid MechanicsResidual StressStress MonitoringElectronic PackagingStructural MechanicsIfem MethodologyMechanics Of Materials
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