Publication | Open Access
Microstructural evolution and properties of TLP diffusion bonding super-Ni/NiCr laminated composite to Ti-6Al-4V alloy with Cu interlayer
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Citations
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References
2017
Year
Materials EngineeringMaterials ScienceEngineeringSuperalloyTlp DiffusionApplied PhysicsAlloy DesignMicrostructural EvolutionHigh-performance MaterialAlloy PhaseCu InterlayerMicrostructureMaterial Preparation
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