Publication | Closed Access
Preparation and Properties of CL‐20 based Composite by Direct Ink Writing
35
Citations
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References
2017
Year
Materials ScienceMaterials EngineeringChemical EngineeringHigh DensityMicro‐scale ChargingEngineeringMaterials FabricationMechanical EngineeringComposite TechnologyPolymer ProcessingPrinted ElectronicsMaterial InnovationHigh-performance MaterialMaterial PerformancePulse PowerEnergetic MaterialsDirect Ink Writing
Abstract Direct ink writing (DIW) is a new trend in the micro‐scale charging of energetic materials. In this study, a CL‐20 based composite was prepared using DIW, and its properties were characterized. Results indicated that the particles of the composite are found at the sub‐micron level, and a single layer measures at 2.4 μm. The composite has high density and low impact sensitivity, and its critical detonation size is around 1×0.4 mm. This feature will contribute to the detonation at the micro levelto a certain degree.
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