Concepedia

Effect of Ti content on the metallization layer and copper / alumina brazed joint

Wei Fu, Shengpeng Hu, Xiaoguo Song, Chao Jin, J.X. Li, Yang Zhao, Jian Cao, G.D. Wang

Ceramics International · 2017 · 38 citations · 31 references

DOI

Concepts

References

31

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

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The Cu-Sn (Copper-Tin) system

Nigel J. Saunders, A. P. Miodownik · Bulletin of Alloy Phase Diagrams · 1990 · 327 citations

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Review Article: recent advances in metal-ceramic brazing

Rubens M. Nascimento, A. E. Martinelli, A.J.A. Buschinelli · Cerâmica · 2003 · 151 citations · Full text

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Brazing copper to alumina using reactive CuAgTi alloys

O.V. Kozlova, Muriel Braccini, R. Voytovych et al. · Acta Materialia · 2009 · 127 citations

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Interfacial reactions between sapphire and Ag–Cu–Ti-based active braze alloys

M. Ali, Kevin M. Knowles, Phillip M. Mallinson et al. · Acta Materialia · 2015 · 121 citations · Full text

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