Publication | Open Access
Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties
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Citations
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References
2017
Year
Materials EngineeringMaterials ScienceEngineeringCastingSteel MoldsMechanical EngineeringAlloy DesignSn-0.2ni Solder AlloyWater-cooled CopperHot WorkingMetallurgical ProcessSolidificationMicrostructureMetal Processing
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