Optimization of Thermoelectric Cooling System for Application in CPU Cooler

Abstract

A multi-objective optimization based on thermoelectric heat exchanger module (TEHEM) is presented for application in CPU cooler. The thermoelectric heat exchanger module coupling multi-parameters is used as a novel method to solve the heat dissipation. Assuming that thermal-power consumption and physical properties of thermoelectric material are known, the optimal operating conditions covering with working current and hot-side thermal resistance are derived analytically from previous module. By combining the surface temperature of CPU and input power with a weight factor as the multi-objective function, the optimization is again implemented. Simultaneously, the multi-objective optimization is compared with the surface temperature of CPU and input power as the single-objective function. Finally, the optimal conditions are investigated to get a balance between the surface temperature and the input power. The simulation results show the optimal variables for single objective function are not suitable multi objective function sometimes. It is indispensable to consider the relative importance of objective values when it comes to practical demand. In addition, the optimal operating conditions depend on intensities of these operating parameters.