Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation - Concepedia

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Mechanical properties of cured isotropic conductive adhesive (ICA) under hygrothermal aging investigated by micro-indentation

21

Citations

37

References

2017

Year

Gesheng Xiao, Erqiang Liu, Tao Jin, Xuefeng Shu, Zhihua Wang, Guozheng Yuan, Xuexia Yang

International Journal of Solids and Structures

Materials ScienceEngineeringMechanical PropertiesAdhesive MaterialMechanical EngineeringAdhesive MaterialsStructural Adhesive

References

	Year	Citations

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