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Fatigue strain mapping via digital image correlation for Ni-based superalloys: The role of thermal activation on cube slip

Materials ScienceEngineeringSevere Plastic DeformationSuperalloyCube SlipMechanical EngineeringThermal ActivationStressstrain AnalysisSolid MechanicsMicrostructure-strength RelationshipFatigue Strain MappingLow-cycle FatigueMechanics Of MaterialsMicrostructure