Publication | Closed Access
Mechanical properties and interfacial structure of hot-roll bonding TA2/Q235B plate using DT4 interlayer
79
Citations
18
References
2017
Year
Materials ScienceMaterials EngineeringEngineeringMechanical PropertiesMechanical EngineeringInterfacial StructureChip AttachmentDt4 InterlayerElectronic Packaging
| Year | Citations | |
|---|---|---|
Page 1
Page 1