Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power - Concepedia

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Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power

44

Citations

39

References

2017

Year

Ai Ting Tan, Ai Wen Tan, Farazila Yusof

Journal of Alloys and Compounds

Materials ScienceFriction WeldingEngineeringLow Ultrasonic PowerMechanical PropertiesMechanical EngineeringMetallurgical InteractionSolid MechanicsCu/sac305/cu Solder JointsMechanics Of MaterialsMicrostructureMetal Processing

References

	Year	Citations

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