Publication | Closed Access

An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry

3D Ic ArchitectureChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)High-speed Dry HobbingChip On BoardMechanical EngineeringChip GeometryChip AttachmentChip Heat-carrying CapacityThermodynamicsHeat TransferElectronic PackagingMicroelectronicsThermal Engineering3D Printing