IEEE Transactions on Applied Superconductivity · 2016 · 11 citations · 6 references
Natural SciencesElectrical EngineeringMaterials EngineeringElectronic MaterialsPolymer EngineeringPolymer MaterialsDielectric MaterialsDielectric PropertiesDielectricsElectrical ConductivityInsulation MaterialsSuperconducting MaterialsCable InsulationCable MaterialsDielectric Loss MechanismsElectrical InsulationElectrical Insulation MaterialsInsulation TechnologyLow-loss Dielectric MaterialsLow-loss Materials
Toward the practical development of high-voltage high-temperature superconducting (HTS) cables, high electrical insulation characteristics, and low dielectric loss become important. Dielectric loss drastically increases with the increase of operation voltage of HTS cables. Therefore, it is highly expected to find a novel insulating material with low dielectric loss for the high-voltage HTS cables. We have focused on Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> , polyethylene (PE) nonwoven fabric, and Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> /PE, a syntactic paper bonding PE-sheet on Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> by heat, as low dielectric loss materials. In this paper, we investigated fundamental partial discharge inception characteristics and their mechanisms of Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> immersed in liquid nitrogen (LN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> ).In addition, we compared the electrical insulation characteristics of Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> , Tyvek <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> /PE, and polypropylene laminated paper (PPLP <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">®</sup> ), and discussed their mechanisms.
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Naoki Hayakawa, Takashi Kobayashi, Moriyuki Hazeyama et al. · IEEE Transactions on Dielectrics and Electrical Insulation · 2005 · 20 citations · Full text
Natural Sciences, Electrical Engineering, Materials Engineering +16