Publication | Open Access

Enhanced electrical conductivity and reliability for flexible copper thin-film electrode by introducing aluminum buffer layer

Materials ScienceEnhanced Electrical ConductivityElectrical EngineeringElectromigration TechniqueEngineeringFlexible ElectronicsApplied PhysicsAluminum Buffer LayerElectronic PackagingElectrochemical InterfaceThin Film ProcessingElectrochemistryElectrical Insulation