214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser Module

Abstract

We fabricated a Hi-FIT LE-EADFB laser module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this module, we demonstrated a single-wavelength single-polarization direct-detection 4-PAM transmission with a record net data rate of 200 Gb/s. And with 4-PAM operation at 214 Gb/s, we obtained a BER of less than 3.8 × 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> , which is an error-free condition using a 7%-OH HD-FEC code, even after a 10-km SMF transmission.